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  • image of the material 'iglidur® A160'

    iglidur® A160 (iglidur® A160)

    igus GmbH

    category thermoplastics
    application temperature -50 – 90  °C
    thermal conductivity 0.3  W/(K*m)
  • image of the material 'iglidur® A180'

    iglidur® A180 (iglidur® A180)

    igus GmbH

    category thermoplastics
    application temperature -50 – 90  °C
    thermal conductivity 0.25  W/(K*m)
  • image of the material 'iglidur® A181'

    iglidur® A181 (iglidur® A181)

    igus GmbH

    category thermoplastics
    application temperature -50 – 90  °C
    thermal conductivity 0.25  W/(K*m)
  • image of the material 'iglidur® A350'

    iglidur® A350 (iglidur® A350)

    igus GmbH

    category thermoplastics
    application temperature -100 – 180  °C
    thermal conductivity 0.24  W/(K*m)
  • image of the material 'iglidur® A500'

    iglidur® A500 (iglidur® A500)

    igus GmbH

    category thermoplastics
    application temperature -100 – 250  °C
    thermal conductivity 0.24  W/(K*m)
  • image of the material 'iglidur® G'

    iglidur® G (iglidur® G)

    igus GmbH

    category thermoplastics
    application temperature -40 – 130  °C
    thermal conductivity 0.24  W/(K*m)
  • image of the material 'iglidur® J'

    iglidur® J (iglidur® J)

    igus GmbH

    category thermoplastics
    application temperature -50 – 90  °C
    thermal conductivity 0.25  W/(K*m)
  • image of the material 'iglidur® M250'

    iglidur® M250 (iglidur® M250)

    igus GmbH

    category thermoplastics
    application temperature -40 – 80  °C
    thermal conductivity 0.24  W/(K*m)
  • image of the material 'iglidur® W300'

    iglidur® W300 (iglidur® W300)

    igus GmbH

    category thermoplastics
    application temperature -40 – 90  °C
    thermal conductivity 0.24  W/(K*m)
  • image of the material 'iglidur® X'

    iglidur® X (iglidur® X)

    igus GmbH

    category thermoplastics
    application temperature -100 – 250  °C
    thermal conductivity 0.6  W/(K*m)
  • image of the material 'PICMA Stack/Chip'

    PICMA Stack/Chip

    Fraunhofer IWU, Abteilung Adaptronik

    category Piezokeramiken
    application temperature -40 – 150  °C
    thermal conductivity
  • image of the material 'PICMA Stack/Chip'

    PICMA Stack/Chip

    Fraunhofer IWU, Abteilung Adaptronik

    category Piezokeramiken
    application temperature -40 – 80  °C
    thermal conductivity
  • image of the material 'PICA Stack/Power/Thru'

    PICA Stack/Power/Thru

    Fraunhofer IWU, Abteilung Adaptronik

    category Piezokeramiken
    application temperature -40 – 150  °C
    thermal conductivity
  • image of the material 'PICA Stack/Power/Thru'

    PICA Stack/Power/Thru

    Fraunhofer IWU, Abteilung Adaptronik

    category Piezokeramiken
    application temperature -40 – 150  °C
    thermal conductivity
  • image of the material 'DuraAct'

    DuraAct

    Fraunhofer IWU, Abteilung Adaptronik

    category Piezokeramiken
    application temperature -20 – 150  °C
    thermal conductivity
  • image of the material 'PICMA Bender'

    PICMA Bender

    Fraunhofer IWU, Abteilung Adaptronik

    category Piezokeramiken
    application temperature -20 – 150  °C
    thermal conductivity
  • image of the material 'Kupfer-Beryllium-Legierung'

    Alloy M25 (17300) (Kupfer-Beryllium-Legierung)

    Materion Brush GmbH

    category corroding heavy metals
    application temperature
    thermal conductivity 105  W / (m K)
  • image of the material 'Kupfer-Legierung'

    MoldMAX HH® (Kupfer-Legierung)

    Materion Brush GmbH

    category corroding heavy metals
    application temperature
    thermal conductivity 130  W / (m °C)
  • image of the material 'Kupfer-Nickel-Silizium-Chrom-Legierung'

    MoldMAX V® (Kupfer-Nickel-Silizium-Chrom-Legierung)

    Materion Brush GmbH

    category corroding heavy metals
    application temperature
    thermal conductivity 160  W / (m °C)
  • image of the material 'Kupfer-Nickel-Zinn-Legierung'

    ToughMet® 2 CX (Kupfer-Nickel-Zinn-Legierung)

    Materion Brush GmbH

    category corroding heavy metals
    application temperature
    thermal conductivity 52  W / (m °C)

category

  1. nonmetals 20
  2. synthetical 20
  3. plastics 19
  4. organic 19
  5. thermoplastics 14
  6. metals 12
  7. show 9 more

Application areas

  1. food contact 21
  2. seals 20
  3. insulation 14
  4. electronics 13
  5. beverage industry 7
  6. fire protection 5
  7. show 21 more

certificate

  1. Verordnung (EG) 1935/2004 20
  2. TA Luft 12
  3. GL 11
  4. §§30 und §§31 Lebensmittel-, Bedarfsgegenstände- und Futtermittelgesetzbuch (LFGB) 11
  5. Blow-out VDI 2200 10
  6. FDA (CFR Title 21) 10
  7. show 11 more

producer

  1. Frenzelit GmbH
  2. igus GmbH
  3. Materion Brush GmbH
  4. PI Ceramic
  5. Röchling Engineering Plastics SE & Co. KG 144
  6. Röchling Sustaplast SE & Co. KG 84
  7. Röchling Engineering Plastics 72
  8. Mitsubishi Chemical Advanced Materials 67
  9. Rhenotherm Kunststoffbeschichtungs GmbH 57
  10. Wefapress Beck + Co. GmbH 51
  11. show 21 more
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